MediaTek Dimensity 9200+ Pushes Flagship Smartphone Performance
The Dimensity 9200+ chipset has one ultra-core Arm Cortex-X3 at 3.35GHz, three Arm Cortex-A715 super-cores at 3.0GHz, and four Arm Cortex-A510 efficiency cores at 2.0GHz. MediaTek increased the Dimensity 9200+'s Arm Immortalis-G715 GPU by 17% for gaming and other compute-intensive apps.
The Dimensity 9200+'s 4CC-CA 5G Release-16 modem seamlessly changes between long-range sub-6GHz and super-fast mmWave connections. The processor supports Bluetooth 5.3 and Wi-Fi 7 2x2 + 2x2 with up to 6.5Gbps data rates. MediaTek's Bluetooth and Wi-Fi coexistence technology lets Wi-Fi, Bluetooth low energy (LE) audio, and wireless peripherals connect without latency or interference.
Key features of the MediaTek Dimensity 9200+ include:
- HyperEngine 6.0: Further improving the gaming experience with adaptive performance technology capable of sustaining high framerates and minimizing latency.
- Second generation TSMC 4nm-class process: Ideal for ultra-slim designs in a variety of form factors.
- Sixth generation AI Processing Unit (APU 690): Efficiently powers AI-noise reduction and AI-super resolution tasks, and creates truly cinematic video through real-time focus and Bokeh adjustments.
- MediaTek Imagiq 890: Powerful flagship image signal processor that supports captivating capture, providing bright, sharp images and videos even in low-light scenarios.
- MediaTek MiraVision 890: Display technology with adaptive refresh rate technology and motion blur reduction for a fluid user experience.
- MediaTek 5G UltraSave 3.0: Power efficiency technologies to optimize battery life for all 5G connection conditions.
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