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MediaTek Dimensity 9300 Chipset, Latest Flagship lagship Mobile chip with All Big Core Design!

MediaTek Dimensity 9300

MediaTek unveiled its latest flagship mobile chip, the Dimensity 9300, which features a distinctive All Big Core design. It offers high performance with MediaTek's power efficiency, providing unparalleled user experiences in gaming, and on-device generative AI processing.

MediaTek's APU 790 in the Dimensity 9300 enhances generative AI and energy efficiency for fast, secure edge computing. Doubling integer and floating-point operations, the APU 790 reduces power consumption by 45%. Transformer model adaptation boosts processing speed by 8x, achieving one-second image generation with Stable Diffusion.

MediaTek Dimensity 9300

Combining INT4 quantization and NeuroPilot memory compression optimizes memory bandwidth and trims requirements for large AI models. APU 790 supports NeuroPilot Fusion for continuous LoRA low-rank adaptation, accommodating language models from 1B to 33B parameters. Within MediaTek's AI ecosystem, the Dimensity 9300 backs major language models, such as Meta Llama 2, Baichuan 2, and Baidu AI LLM, facilitating the efficient deployment of multi-modal generative AI applications for text, images, and music.

The Dimensity 9300, featuring Arm's Immortalis-G720 GPU, enhances mobile gaming with an impressive 46% GPU performance boost and a 40% reduction in power consumption compared to the previous generation chipset. This significant upgrade maintains performance levels without compromising battery life.

Combining an extreme octa-core CPU design with MediaTek's second-generation raytracing engine, smartphones powered by the Dimensity 9300 achieve console-level global illumination effects at a smooth 60 FPS. This powerful chipset also enables seamless multitasking, allowing users to game, video stream, or watch another video simultaneously.

In terms of mobile photography and video capture, it supports a low-power AI-ISP and always-on HDR up to 4K at 60 fps. It features cinematic mode with real-time bokeh tracking, 4K AI noise reduction, and AI processing on raw content. Additionally, the chipset supports the new Ultra HDR format in Android 14, offering vibrant photos. The Dimensity 9300 further enhances photography with ambient light adaptive HDR recovery technology.

The Dimensity 9300's display system uses on-device AI to detect and enhance primary objects and backgrounds in real-time, creating lifelike video experiences similar to flagship DTVs. It uses the MiraVision PQ engine for dynamic adjustments in contrast, sharpness, and color.

Additionally, the chipset supports Wi-Fi 7 speeds up to 6.5 Gbps, integrates MediaTek Xtra RangeTM Technology for improved long-range connectivity, and enhances smartphone tethering speeds by up to 3X with Multi-Link Hotspot technology.

Key features of the MediaTek Dimensity 9300:

1. Big Core Power: Built on TSMC's third-generation 4nm process, featuring four Arm Cortex-X4 cores with speeds up to 3.25GHz and four Cortex-A720 cores operating at up to 2.0GHz for maximum performance.

2. Faster Display Speeds: Supports WQHD at 180Hz and 4K at up to 120Hz, providing stunning visuals, and dual active display support for foldable form factors.

3. Seamless 5G Connectivity: The 5G R16 modem supports 4CC-CA Sub-6GHz and 8CC-CA mmWave with MediaTek’s UltraSave 3.0+ technology for improved power efficiency.

4. Speedy Memory: Supports LPDDR5T 9600Mbps memory, currently the highest available speed.

We can expect the first smartphones featuring the Dimensity 9300 chipset will be available in the market by the end of 2023 or early 2024.
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